THGAMVG8T13BAIL
- 发布时间：2023/4/25 10:23:30
- 所属类别：集成电路 » 集成电路
- 公 司：深圳市利源芯科技有限公司
THGAMVG8T13BAIL属性
- 特价
- 存储芯片
- BGA153
- KIOXIA/铠侠
THGAMVG8T13BAIL描述
THGAMVG8T13BAIL
Process
BiCS
Capacity
32GB
e-MMC Version
5.1
Max Data Rate(MB/s)
400
VCC (V)
2.7 to 3.6
VCCQ (V)
1.70 to 1.95
Operating Temperature(℃)
-25 to 85
Package Size(mm)
11.5x13.0x0.8
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