1。Kintex UltraScale+产品优势，如：XCKU9P-L1FFVE900i
k xilinx kintex<ultrascale+}现场可编程阵列（fpa）具有多种电源选择，可以在要求的系统性能和非常低的功耗之间达到最佳平衡。fpga是一种基于可配置逻辑块（clb）矩阵的半导体器件，通过可编程互连系统连接。Kintex UltraScale+设备是数据包处理和DSP密集型功能的理想选择，适用于从无线mimo技术到NX100G网络和数据中心的各种应用。
特性
可编程系统集成
高达1.2m的系统逻辑单元
用于片上存储器集成的UltraRAM集成100G以太网MAC以支持RS-FEC和150G因特拉肯内核
提高系统性能
o.3 teramac dsp计算性能
与kintex-7fpga相比，系统级性能功率比提高了两倍以上。
o 16G和28G背板-支持各种收发器
o中速级支持2666MB/s DDR4
降低物料清单成本
o 12.5gb/s最低速度等极收发器
集成vcxo和fpll可以降低时钟组件的成本。
降低总功耗
o.与7系列FPGAs相比，功耗降低了60%
o.电压缩放选项支持高性能和低功耗
o.使用紧凑的逻辑单元封装以降低动态功耗
提高设计生产力
o使用vivado设计套件进行协作优化，以加速设计收敛
智能连接技术在智能ip集成中的应用
112mhz点对点mwr调制解调器及数据包处理
_ 1GHz宽带调制解调器和数据包处理
1. Kintex UltraScale + product advantages such as: XCKU9P-L1FFVE900I
K Xilinx Kintex < UltraScale+} Field Programmable Array (FPA) has a variety of power options, which can achieve the best balance between the required system performance and very low power consumption. The FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnection system. Kintex UltraScale + devices are ideal for data packet processing and DSP-intensive functions, and are suitable for applications ranging from wireless MIMO technology to Nx100G network and data center.
Characteristic
Programmable System Integration
Up to 1.2M System Logic Unit
UltraRAM for on-chip memory integrationO Integrating 100G Ethernet MAC to support RS-FEC and 150G Interlaken Kernel
Improving system performance
O.3 TeraMAC DSP Computing Performance
O. Compared with Kintex-7 FPGA, the system-level performance-power ratio has been improved by more than two times.
O 16G and 28G backboards - support various transceivers
O Medium Speed Class Supports 2666Mb/s DDR4
Reducing BOM costs
O 12.5Gb/s transceiver with the lowest speed equal pole
O. The integration of VCXO and fPLL can reduce the cost of clock components
Reduced total power consumption
O. Power consumption is reduced by 60% compared with 7 series of FPGAs
O. Voltage scaling options support high performance and low power consumption
O. Using compact logic unit encapsulation to reduce dynamic power consumption
Increased design productivity
O Collaborative optimization with Vivado Design Suite to accelerate design convergence
Application of Smart Connect Technology for Intelligent IP Integration
112 MHz Point-to-Point MWR Modem and Data Packet Processing
_1GHz eBand Modem and Data Packet Processing
XCVU190-2FLGB2104I
XCVU5P-2FLVB2104E
XCVU5P-2FLVB2104I
XCVU5P-1FLVB2104E
XCVU440-2FLGA2892E
XCVU440-1FLGA2892C
XCVU440-2FLGB2377E
XCVU440-1FLGB2377C
XC7V2000T-1FLG1925C
XC7VX690T-L2FFG1926E
