USB2514B-AEZG
USB3343-CP-TR
USB3300-EZK
USB3319C-CP-TR
USB3317C-CP-TR
LAN9220-ABZJ
LAN8710A-EZK-TR
LAN8720A-CP-TR
LAN9303-ABZJ
Descriptions
The USB331x family of Hi-Speed USB 2.0 transceivers provides a highly integrated, small footprint solution designed for portable consumer electronics devices including cell phones, PDAs, portable media players and GPS/personal navigation devices. The USB331x family eliminates the need for external USB switches and electrostatic discharge (ESD) protection devices, which minimizes eBOM part count and printed circuit board (PCB) area. The USB331x provides an extremely flexible solution which allows the USB connector to act as a single port of connection for high speed data transfer, battery charging and stereo/mono audio acce
Features
USB-IF“Hi-Speed”complianttotheUniversalSerialBusSpecificationRev2.0
InterfacecompliantwiththeULPISpecificationrevision1.1asaSingleDataRate(SDR)PHY
1.8VIOVoltage(±10%)
flexPWR
Technology
Lowcurrentdesignidealforbatterypoweredapplications
“Sleep”modetri-statesallULPIpinsandplacesthepartinalowcurrentstate
SupportsFSpre-ambleforFShubswithaLSdeviceattached(UTMI+Level3)
SupportsHSSOFandLSkeep-alivepulse
IncludesfullsupportfortheoptionalOn-The-Go(OTG)protocoldetailedintheOn-The-GoSupplementRevision1.0aspecification
SupportstheOTGHostNegotiationProtocol(HNP)andSessionRequestProtocol(SRP)
AllowshosttoturnVBUSofftoconservebatterypowerinOTGapplications
SupportOTGmonitoringofVBUSlevelswithinternalcomparators
“Wrapper-less”designforoptimaltimingperformanceanddesignease
LowLatencyHi-SpeedReceiver(43Hi-SpeedclocksMax)allowsuseoflegacyUTMILinkswithaULPIbridge
Internal5Vcableshort-circuitprotectionofID,DPandDMlinestoVBUSorground
13MHzReferenceClockOperation
0to3.6Vinputdrivetolerant
Abletoaccept“noisy”clocksources
InternallowjitterPLLfor480MHzHi-SpeedUSBoperation
InternaldetectionofthevalueofresistancetogroundontheIDpin
Integratedbatteryto3.3VLDOregulator
2.2uFbypasscapacitor
100mVdropoutvoltage
IntegratedESDprotectioncircuits
Upto±15kVwithoutanyexternaldevices
CarkitUARTmodefornon-USBserialdatatransfers
IntegratedUSBSwitch
AllowssingleUSBportofconnection
Highspeeddata
Batterycharging
Stereoandmono/micaudio
USB1.1data
IndustrialOperatingTemperature-40°Cto+85°C
PackagingOptions
24pinQFNlead-freeRoHScompliantpackage(4x4x0.90mmheight)
25ballVFBGAlead-freeRoHScompliantpackagealsoavailable;(3x3x0.88mmheight)
车用芯片供应商英飞凌首席营销官HelmutGassel博士在周四的年度股东大会上表示，晶圆代工制造商的营运情形不妙，扩展英飞凌自身的产能则需要时间。这也意指英飞凌自家的晶圆制造工厂产能扩充不易。Gassel补充表示，希望在本财年的下半能看见某种程度的缓解；英飞凌已经提前了奥地利Villach市新工厂的开启计划。
英飞凌CEO普洛斯（Reinhard Ploss）指出，奥地利Villach的新工厂，预计夏季末开始投产，每年将有能力生产足够的电源半导体（车用电源管理晶片），足够为2500万辆电动车配备驱动装置。
分析师表示，车用芯片例如微控制器的供应吃紧，将持续到今年年中；芯片制造商此前对于突然复苏的需求未能及时调适。
英飞凌对Villach市的晶圆厂投入16亿欧元（约合19.5亿美元），与该公司在德国德勒斯登市（Dresden）既有的晶圆厂，共同增加了生产的弹性。Ploss表示，“这将让我们如同一家工厂般，在两个地方控制生产。”
英飞凌同时证实了本财年（截至9月底）的全年108亿欧元营收的财测以及获利率17.5％的目标。
英飞凌也任命了Constanze Hufenbecher，为新成立的数位转型长，协助该公司以100亿美元收购Cypress半导体之后，进行相关的合并整合工作。
