EPM7256AEFC256-10N参数如下 ：
IHS 制造商 INTEL CORP
包装说明 BGA, BGA256,16X16,40
Reach Compliance Code compliant
ECCN代码 3A991
HTS代码 8542.39.00.01
风险等级 5.09
其他特性 YES
最大时钟频率 95.2 MHz
系统内可编程 YES
JESD-30 代码 S-PBGA-B256
JESD-609代码 e1
JTAG BST YES
长度 17 mm
湿度敏感等级 3
专用输入次数
I/O 线路数量 164
宏单元数 256
端子数量 256
最高工作温度 70 °C
最低工作温度
组织 0 DEDICATED INPUTS, 164 I/O
输出函数 MACROCELL
封装主体材料 PLASTIC/EPOXY
封装代码 BGA
封装等效代码 BGA256,16X16,40
封装形状 SQUARE
封装形式 GRID ARRAY
峰值回流温度（摄氏度） 260
电源 2.5/3.3,3.3 V
可编程逻辑类型 EE PLD
传播延迟 10 ns
认证状态 Not Qualified
座面最大高度 2.1 mm
子类别 Programmable Logic Devices
最大供电电压 3.6 V
最小供电电压 3 V
标称供电电压 3.3 V
表面贴装 YES
技术 CMOS
温度等级 COMMERCIAL
端子面层 TIN SILVER COPPER
端子形式 BALL
端子节距 1 mm
端子位置 BOTTOM
处于峰值回流温度下的最长时间 40
宽度 17 mm
Base Number Matches 1
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